We can support you from end to end of your product life cycle
PHYTEC specializes in design and manufacture of processor based solutions for the industrial embedded market. Our OEM and ODM services cover the complete spectrum of the product life cycle from concept to design through manufacturing and after-market services. Our engineering expertise encompasses complex PCB design, operating system driver development, thermal management, shock and vibration, size and weight constraints, mechanical engineering, and more. This expertise provides an end to end turnkey solution for companies seeking full product development services from a single source. Our capabilities cover the complete life of a product from concept to design through manufacturing and life cycle management.
Expertise across multiple industries
PHYTEC has over 2 decades of systems integration experience across multiple industries that include medical, automotive, control and automation, transportation and energy.
PHYTECs expertise and experience across a wide range engineering disciplines enable us to innovatively solve complex systems challenges.
PHYTEC SOMs complement our system integration services by providing a production-ready hardware and software solution for accelerated time to market.
System Engineering: We work closely with you to understand your project needs, providing systems level consulting, architectural study, and professional management services tailored to the needs of your project.
Software Engineering: PHYTEC offers a complete set of software development services from bootloader and device drivers up through the application and user experience levels. We are a full solution provider for the implementation of Linux, Android, and Windows in embedded systems.
PCB Hardware Design: PHYTEC has a full staff of PCB engineers and designers with strong expertise in advanced 32-bit microprocessor design and experience on over 1,000+ PCB assembly designs.
Mechanical Design: PHYTEC’s in-house mechanical design and assembly capabilities include ruggedized box build using advanced metal and plastic injection molding. Our processes meet the most exacting enclosure EMI protection, Thermal dissipation and industrial environment operation requirements such as MIL-STD-810G and IP67.
Manufacturing: PHYTEC has an annual production throughput of over 250,000 assemblies. Our manufacturing equipment, ISO 9001/2008-certified processes, cost model and Enterprise Resource Planning (ERP) system are designed to meet the challenges of a high-mix, low-to-medium volume production. We meet stringent production standards (IPC-600A-F class 2/3, IPC-610 class 2, ROHS, REECH, WEEE, VDA, KTA140, etc...). Our test capabilities include AOI, x-ray, ICT, FKT, ST, Burn-in, etc...).
Logistics: Through our global supply chain network we offer ISO 9001/2008-certified demand fulfillment; inventory management including consignment; continuous product cost reduction efforts; reserved component stock and lifetime buy (LTB) programs; and 10 year-plus product lifecycle support.
Quality Assurance: Our uncompromising build quality are highly qualified for ambitious projects. PHYTEC adheres to exacting quality standards to meet the requirements of customers for complex product development. In addition to our standard ISO9001:2008 certification, our quality standards have been confirmed by successful audits evidencing the suitability of PHYTEC products for deployment in nuclear power plants (KTA1401) and the life-sustaining medical devices (VDA2). Our quality assurance processes can be tailored to the specific requirements of each customer.